About the job
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Michael Page
  • Own technology roadmap and product innovation strategy

  • Exposure to precision motion systems, and mechatronic product development. About Our Client With strong global R&D capabilities and a growing product portfolio, they are investing heavily in next-generation technologies and seeking an experienced R&D leader to drive innovation and product development.

  • Lead the development of advanced semiconductor packaging equipment

  • Drive innovation in precision motion systems and mechatronic technologies

  • Manage R&D projects from concept, validation, NPI to commercialization

  • Oversee product industrialization, manufacturing support and yield improvement

  • Collaborate with global R&D, manufacturing, suppliers and product teams

  • Support technology innovation, patent development and IP generation

  • Lead and develop high-performing engineering teams The Successful Applicant

  • Master's degree in Mechanical Engineering or related disciplines

  • 6+ years of experience in semiconductor equipment, advanced packaging or precision engineering

  • Proven track record in product development and R&D project leadership

  • Strong knowledge of semiconductor packaging processes and equipment

  • Experience in precision motion control, mechatronic design and product validation

  • Familiarity with ultrasonic or piezoelectric technologies is an advantage

  • Experience in DFM, DFA, NPI and manufacturing support

  • Strong problem-solving, project management and stakeholder management skills

  • Experience working in a multinational engineering environment preferred What's on Offer

  • Lead cutting-edge semiconductor packaging technology development

  • Exposure to advanced packaging, AI semiconductor and precision automation industries

  • Regional and global R&D project exposure Quote job ref: JN-102026-7118384

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