Head of R&D

A leading global electronics manufacturing services provider seeks a Head of R&D in Hong Kong to lead Joint Design Manufacturing (JDM) engineering and drive innovative electronic product development from concept to mass production. Key Responsibilities As Head of R&D, you will lead global engineering teams and end-to-end product development, driving technical excellence, operational efficiency, and successful delivery from concept to production.

• Lead and develop a high-performing, multidisciplinary engineering team, fostering technical excellence, quality, continuous improvement, talent acquisition, retention, and succession planning
• Own end-to-end NPI in partnership with customers' design teams, ensuring seamless progression from concept through manufacturing validation and ramp-up
• Drive DFM, DFT, DFQ, and DFC methodologies to enable scalable production while meeting quality and cost targets
• Collaborate with global manufacturing and supply chain teams to accelerate time-to-market, optimise resources, and improve project delivery, capacity utilisation, and quality performance
• Define and execute the engineering roadmap around emerging trends including IoT, AI, and sustainability, while strengthening cross-disciplinary hardware, software, and cloud integration
• Ensure engineering compliance with international standards, ISO certifications, and safety/regulatory requirements through metrics-driven processes that improve operational efficiency and product quality Candidate Profile
• Bachelor's degree in Electrical Engineering or related field; Master's or PhD highly desirable, with 15+ years' engineering leadership experience in EMS, ODM, or similar environments
• Proven success leading global engineering teams of 50+ across multiple countries, with strong cross-cultural communication and stakeholder management skills
• Extensive NPI experience from concept through high-volume manufacturing, with strong expertise in DFM, DFQ, and DFC methodologies
• Broad technical expertise across hardware, firmware, software, mechanical design, packaging, industrial engineering, cloud-connected products, embedded systems, and IoT
• Strong strategic thinking, commercial acumen and P&L awareness, with Agile or Stage-Gate project management experience and familiarity with CAD, PLM, and ALM tools
• Fluent English required; Mandarin or Cantonese highly advantageous, with willingness to travel globally up to 25% of the time About This Company This electronics manufacturing services organisation delivers end-to-end solutions that combine engineering expertise, innovation, and high-quality product development. It fosters a collaborative, inclusive environment focused on knowledge sharing, continuous learning, and future-ready technologies while supporting employees' professional growth. Keywords: R&D Leadership, Electronics Engineering, New Product Introduction, IoT Technology, Design for Manufacturing What's Next Shape the future of electronic product innovation by leading global R&D and turning complex ideas into market-ready solutions. Apply now!